Purpose of the development: Designed to create a conductive connection of elements in the instrument, as well as in medical equipment.

Recommended application field: Manufacture and repair of elektronnoytehniki and electronic devices. Clay can provide current carrying joints in dissimilar metal couples - steel, copper, aluminum, brass, in different compounds.

Technical characteristic: External Data film is dark gray The adhesion of the steel at Shear tests, 14-16 MPa Volume resistivity, ohm m x (0.5-1.0) x 10 -4 raising Transient electrical adhesive compounds steel Ohm x m2 (2-6) x 10 - 6 degrees Bonding modes: teiperatura, hail. With 140 - 150 time minutes 5 - 10 The viability of unlimited Operating temperature range use of adhesive joints, degrees. C -60 - +100

Advantages over analogues: The advantage of hot melt "Termokont" Survivors of conventional thermal conductivity of liquid-based adhesives is the creation of a short time electrical conductivity of the compound (5-10 minutes instead of hours) and the convenience of use, no need for batching.

The development stage readiness: Ready for application

Description of the development:
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Hot melt glue "Termokont" is a conductance polymer film that is placed in the gap between the metal parts to be joined. The junction temperature is warming up to 140-150 degrees. C, whereby the adhesive is melted. After cooling, the adhesive provides mechanical and conductive connection details. Prior to bonding the metal surface is cleaned of fat and oily impurities scale mechanical and chemical means. Details for bonding combined under slight pressure.

Possibility of transfer abroad:
Licence's sale
Creation of joint enterprise

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua