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SUBSTRATES FOR SOLID-ELECTRONIC DEVICES
Purpose of the development:
Various devices of solid-state electronics having heat release.
Technical characteristic:
" Microhardness HB, GPa: 50-60;
" Thermal conductivity, W (m*K): 250-300;
" Relative permittivity: 6-7;
" Dielectric dissipation: 0,01 (1 kHz);
" Resistivity, Ohm*cm: 1010;
" Linear thermal expansion factor: ~ 3,106;
" Thermal resistance, K: < 1200.
The substances are corrosive resistant, working surface of the substrate can be finished to a roughness parameter of Ra = 0,1 ?m.
The development stage readiness:
Ready for application
Description of the development:
()
Highly heat-conducting ceramic substrates based on cubic (blond) boron nitride.
corresponds technical description
Conforms to technical characteristic
Possibility of transfer abroad:
Licence's sale
Technological document's sale
Creation of joint enterprise
Realization of finished commodity
Photo
Country
Belarus
For additional information turn to:
E-mail: gal@uintei.kiev.ua
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