Purpose of the development: It is used for making of high-compact heat-exchange temperature.

Recommended application field: Mechanical Engineering. Manufacture of heat-exchange equipment from copper and aluminium alloys with rigid requirements to thermal efficiency and weight-dimension characteristics in microelectronics heat scatterers, aerospace and power engineering industries. Small heat exchangers with a low refrigerating capacity (0.1 - 1 W) are promising to be applied in cryogen and throttle refrigerating systems in electronics, biology and medicine.

Advantages over analogues: The technology as compared with soldering ensures a simultaneous joint of all construction elements of the heat-exchangers, including collectors. The developed products as compared with matrix heat-exchangers (copper-stainless steel) produced by Hitachi (Japan) using vacuum diffusion bonding have less weight and dimensions at the same effectiveness. The use of an original design equipment for diffusion bonding avoids deformation of the elements. There is no need to use complex or A technology having improved technical and economic indices.

The development stage readiness: Pre-production model is made

Description of the development:
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Both unit and technology have been developed to manufacture heat-exchangers on the basis of the same type flat stamped elements bonded through interlayers into a single packet by diffusion bonding in the air. The equipment allows to manufacture heat-exchangers of different types: tubular, plate-ribbed, matrix with different channel systems (counterflow, crossflow, multipath). The devices ensure heat-exchange of two and more flows. Different kinds of heat-carriers can be used: gas-gas, gas-liquid, liquid-liquid. Heat-exchange can be accompanied by phase transformations (boiling and condensation). The heat-exchangers are fabricated as modules. The compactness coefficient is 20000 m2/m2, efficiency coefficient is 94%. Operating pressure range - vacuum - 6 MPa. Operating temperature range is 150-450 K. The Russian patent N 2149087/20.05.2000 is available.

Information about newness of the development:
there are Ukrainian patents -- 1 items

Possibility of transfer abroad:
Licence's sale
Technological document's sale
Combinated reduction to industrial level
Creation of joint enterprise

Photo

Country Russia

For additional information turn to:
E-mail: gal@uintei.kiev.ua