Purpose of the development: Designed for laser drilling and cutting of silicon wafers and other materials.

Recommended application field: Application: - Laser drilling of silicon and other materials; - Micro cutting materials.

Technical characteristic: Main technical characteristics: The size of the treatment area 400 x 400 mm Cutting speed 60 mm / min Materials - silicon metal The laser wavelength 1.06 microns or 0.53 microns The focus diameter 30 mm The pulse repetition rate of 30 kHz The power density on the sample 4h107 W/cm2 The diameter of 150 microns water microjet The water pressure is 20 - 100 bar Power consumption of 1 kW

The development stage readiness: Ready for application

Description of the development:
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Directly to the point of cutting microjet fed high-pressure water, which removes the products of the ablation zone and reduces the thermal effect on the target.

corresponds technical description
Ready for implementation

Possibility of transfer abroad:
Licence's sale
Licence's sale
Technological document's sale
Creation of joint enterprise

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua