Purpose of the development: Designed for laser drilling and cutting of silicon wafers and other materials.

Recommended application field: Application: - Laser drilling holes in a silicon or other materials; - Mikrorezka materials.

Technical characteristic: Main technical characteristics: The size of the treatment area 400 x 400 mm Cutting speed of 60 mm / min Materials silicon metals The laser wavelength of 1.06 microns or 0.53 microns Focal spot diameter of 30 microns Pulse repetition frequency of 30 kHz Power density on the sample 4h107 W/cm2 Diameter water microjet 150 microns Water pressure 20 - 100 bar Power consumption of 1 kW

The development stage readiness: Ready for application

Description of the development:
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The technology is that directly fed to the point of cutting microjet high pressure water, which removes the products of the ablation zone and reduces the thermal effect on the target.

corresponds technical description
Ready for implementation

Possibility of transfer abroad:
Licence's sale
Technological document's sale
Creation of joint enterprise

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua