Declared technologies base

TRANSFER OF INNOVATIONAL TECHNOLOGIES

FLUX FOR LOW TEMPERATURE JOINING


Purpose of the development: Flux is designed for use in mechanized soldering processes and tinkering in the production of electronic equipment.

Recommended application field: Development can be realized in enterprises of electronic industry.

Technical characteristic: 1. Density at 20 grad.tsel. G / cc 0.8350. 2. Temperature range Activity: 190 - 300 grad.tsel. 3. Circularity ratio solder alloy 61 is not less than: Copper: 1.5; on silver: 1.4; Nickel: 1.15. 4. Acid number: 49. 5. Corrosive after soldering of printed circuit boards without the operation of the washing products flux when tested in a humidity chamber for 56 days at a temperature of 40 ± 2 grad.tsel. and a relative humidity of 98 ± 2%: no effect.

Advantages over analogues: No analogues in Ukraine. The analysis made on the basis of a patent search reveals that substantial technical compatibility solutions flux has several advantages over similar products. Flux has low corrosivity and does not require cleaning due to the formation during soldering nonionic organic compounds.

The development stage readiness: Ready for application

Technical and economic effect: Estimated cost of flux in serial production (1000 liters per year) is $ 1 per liter.

Description of the development:
()
The flux comprises a carboxylic acid , a cyclic nitrogen compound ( corrosion inhibitor ) , ethyl alcohol. Unlike fluxes used commercially , for example FKSp , wherein the content of rosin can reach 60 %, the concentration of active ingredients in the proposed flux does not exceed 5 %. The peculiarity of the proposed flux is that the carboxylic acid function is performed not only the active ingredient but also a corrosion inhibitor . After soldering flux residues do not affect the amount of resistance dielectrics ( getinaks , glass fiber ) under conditions of high temperature and humidity environment. Under normal climatic conditions nonionic organic compounds with hydrophobic properties , which are formed during the soldering process , are also able to increase the resistance of the dielectrics.

Information about newness of the development:
there are Ukrainian patents -- 1 items

corresponds technical description
Ready for implementation

Possibility of transfer abroad:
Licence's sale
Licence's sale
Realization of finished commodity

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua

or fill out the form:
Organization name :
Address :
Settlement account :
Bank :
MFO :
OKPO code :

Scientific organization tutor's data :
Surname :
Name :
Patronymic :
Scientific degree :
Phone :
Fax :
E-mail :
Cooperation proposals (joint patent, joint enterprise, assembly sale and so on :
country: