Purpose of the development: Development relates to soldering production, namely, solder paste, which is used for tinning and soldering pins electroradioelements, including chips, solder pads on PCBs and solder them electroradioelements embedded PCB surface mount technology.

Recommended application field: Development can be realized by the enterprises of electronic, electronic, instrument, and other industries.

Advantages over analogues: Advantage of the proposed composition of pasta before analogues is its low corrosivity and high fluxing capacity when soldering.

The development stage readiness: Ready for application

Technical and economic effect: Economic efficiency in the implementation of the invention is that at almost the same cost of chemical components (ingredients) that in the paste - analogs, significantly improves the quality of the soldering, reduces the cost of operation laundering boards and improves reliability and operating (time) resource equipment in general.

Description of the development:
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The technology of manufacturing the paste which is designed not change relative to known compositions . The technology of processing of solder joints ( contacts) with greatly simplified. Presence of solder paste succinic acid significantly enhances its fluxing action to reduce the content of rosin , which significantly reduces the amount of products tarred . Introduction of the solder paste corrosion inhibitor prevents further reduced metal oxidized . As a result of chemical reactions with metallic surfaces of the inhibitor forms a stable compound with hydrophobic properties which protect metals against corrosion in high humidity conditions . In normal climatic conditions the same nonionic organic compound formed during brazing , can also increase the electrical resistance of insulators.

corresponds technical description
Ready for implementation

Possibility of transfer abroad:
Licence's sale
Licence's sale
Combinated reduction to industrial level

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua