Purpose of the development: Technology allows using electrostatic field of high voltage semiconductor devices manufactured assemblies type silicon-glass-silicon-glass and silicon.

Recommended application field: - instrument; - mechanical engineering; - medicine.

Technical characteristic: The possibility of reducing the sealing temperature of 200 ... 250 K

Advantages over analogues: - the stability of the compounds to mechanical shock and vibration; - resistance to thermal shock of the compounds; - vacuum density of the welded joints; - precision welded assemblies.

The development stage readiness: Ready for application

Technical and economic effect: Reducing the cost of production in 3 times.

Description of the development:
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- preparation of quality welds of dissimilar materials in the solid phase of the substantial difference in properties; - a low level of residual stresses in the weld zone.

Information about newness of the development:
there are Ukrainian patents -- 1 items

corresponds technical description
Guarantees stable results getting

Possibility of transfer abroad:
Licence's sale
Combinated reduction to industrial level

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua