Purpose of the development: For copper plating of double-sided and multicharge printed circuit boards.

Recommended application field: Sulfuric acid electrolyte with the addition of "MIDEL" is intended for copper plating of double-sided and multicharge printed-circuit boards and can be used in their production at enterprises of different industries.

Advantages over analogues: It has no analogues in Ukraine. Provides: high level of physical and mathematical properties (relative elongation 10-12%, power limit - 300-350 MPa). The additive "MIDEL" is stable in strongly acidic environments and is nontoxic (grade 4 hazard).

The development stage readiness: Tested experimental exploitation order

Description of the development:
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The use of electrolytes with the addition of "MIDEL" provides the transition to a new copper-plating technology without any changes in the existing equipment of the electroplating shops. The developed technology provides: a high level of physical and mathematical properties (relative elongation of 10-12%, power limit - 300-350 MPa), deposition of brilliant aligned coatings on the surface of printed circuit boards; uniform distribution of metal across the field and in the holes of printed circuit boards; the resistance of a copper conductive ball of sand plates to a cyclic thermal shock.

corresponds technical description
Conforms to technical characteristic

Possibility of transfer abroad:
Licence's sale
Technological document's sale
Combinated reduction to industrial level

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua