Purpose of the development: The development is designed to remove heat from the heat-generating working elements of electronic devices, in particular, processors, chipsets, computer video accelerators, etc.

Recommended application field: The development will be in demand in electrical engineering.

Advantages over analogues: Improvement of heat removal from the heat-generating working elements of electronic devices is achieved due to the three-fold higher thermal conductivity coefficient compared to the existing analogue - KPT-8 paste.

The development stage readiness: The working documentation is developed

Description of the development:
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The use of ZnO nanoparticles in the manufacture of thermal paste instead of ZnO micropowder leads to an increase in the value of its thermal conductivity coefficient from 0.8 to 2.5 W / (m * K).

Information about newness of the development:
there are Ukrainian patents -- 1 items

corresponds technical description
Ready for implementation

Possibility of transfer abroad:
Combinated reduction to industrial level

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua