Purpose of the development: New nanodispersed materials for lead-free solders based on tin Sn-Cu-Ag (SAC) with impurities of metal and nonmetallic nanoparticles designed for use in step-by-step soldering in different temperature ranges have been created.

Recommended application field: It is possible to widespread use in microelectronics, military and household appliances, jewelry and engineering industry.

The development stage readiness: Ready for application

Description of the development:
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According to the EU Directive banning the use of lead-based solders, Ukrainian enterprises (as an associate member of the EU) will introduce new soldering technologies using lead-free solders. The technology for producing materials for lead-free solders in the form of thin strips with a thickness of 20-30 microns by the method of rapid hardening has been improved. The shape of such tapes is convenient for soldering wide sections with precisely defined sizes, which is important for connecting composites with metal matrices. The use of nanoparticles in technology allows one to stabilize the solder structure, which during crystallization will undergo significant modifications under external influences (electric and magnetic fields, temperature gradients, cooling rates, vibrations), prevent the formation of fatigue cracks and creep of contacts, reduce graininess, and improve surface wetting.

Information about newness of the development:
there are Ukrainian patents -- 1 items

corresponds technical description
Ready for implementation

Possibility of transfer abroad:
Combinated reduction to industrial level

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua