Purpose of the development: Designed for vacuum metallization connection plates.

Recommended application field: Development can be realized by enterprises and organizations of the Ministry of Industrial Policy of Ukraine and private industry.

Technical characteristic: Main technical characteristics: - Base material: foil and nefolgirovanny fiberglass, nylon, ceramics, glass, etc .; - The minimum width of the conductors and the spaces between them, 100 microns; - Minimum diameter of through or blind holes Boards with a thickness of 1 mm, 200 microns; - The number of pads resolderings not less than 10; - Adhesion layer of copper to the board kg / sq cm., At least 100; - The maximum size of boards, 600x600 mm; The method allows to apply the dry etching of copper.

Advantages over analogues: The main advantages of the technology: - Providing high-density mounting; - A complete solution to the problem of the quality (reliability) of the metallization and mounting vias boards; - Environmental friendliness due to exclusion of a number of chemical process technology with operations; - Exclusion of the use of precious metals (Paladiy); - Saving of copper and other materials; - Reducing the time of contact with the circuit board solutions. Technical and economic characteristics make the technology competitive in the global market.

The development stage readiness: Tested experimental exploitation order

Technical and economic effect: Economic benefits are based on the exclusion from the process of a number of chemical operations and precious materials, improving the reliability cards, saving copper and reducing the costs of environmental protection measures.

Description of the development:
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Offering environmentally friendly technology, which is based on the original method of vacuum metallization, and provides high-quality coating on the surface of the copper layer and the wall mounting holes and wiring boards can be used in the manufacture of printed circuit boards and hybrid microcircuits for plating: - Installation and vias bilateral, multi-layer and multi-layer circuit boards; - Boards with embossed performing switching; - Dress in a flexible manner; - Hybrid of thick, thin-film circuits.

Information about newness of the development:
there are inventor's certificate -- 2 items

Possibility of transfer abroad:
Licence's sale

Photo

Country Ukraine

For additional information turn to:
E-mail: gal@uintei.kiev.ua