Purpose of the development: For capillary structures miniature flat heat pipes.

Recommended application field: Electronics, personal computers.

Advantages over analogues: Compared to existing miniature flat heat pipes designed heat pipes have a high heat transfer capacity and lower the thermal resistance for the same overall size and weight. Compared with the best foreign analogues price miniature flat heat pipes is significantly lower (1.5 times).

The development stage readiness: Introduced in production

Description of the development:
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Porous powder materials designed for use as capillary structures highly miniaturized planar heat pipes . When the thickness of the heat pipe 2 mm, width 6 mm, length 180 mm, the maximum transmit power is 30 W, the thermal resistance of 0.3 K / watt. Tests of an experimental batch of miniature flat heat pipes , developed technological instruction obtain miniature flat heat pipes with powder capillary structure . Results can be used for the design of cooling electronic equipment, components of personal computers.

Possibility of transfer abroad:
Licence's sale
Technological document's sale
Realization of finished commodity

Photo

Country Belarus

For additional information turn to:
E-mail: gal@uintei.kiev.ua