Purpose of the development: For pre-polishing silicon wafers.

Recommended application field: Electronics manufacturing plants for pre-polishing of optics and electronics products.

Technical characteristic: Specifications: - Density - 1,075-1,085 g/cm3; - The content of SiO2, wt. - 12.5%; - PH of the slurry at 20 ° C - 11,8-12; - Particle size of SiO2 - 10-40 nm; - Price per 1 liter of suspension - 3,3-4,5 units; - Appearance - milky liquid without extraneous mechanical impurities; - Polishing slurry viscosity is 1.25 mPa * s; - Guaranteed shelf life of suspension, subject to the requirements of the developed technical conditions is 6 months.

The development stage readiness: Introduced in production

Technical and economic effect: Application of a polishing slurry for polishing stage of preliminary single-crystal silicon wafers will increase the speed pre-polishing plates and reduce the complexity of operations by 20-30%. refuse to import materials and reduce the cost per unit of final product.

Description of the development:
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Designed concentrated polishing slurry for silicon dioxide based pre-stage polishing wafers of monocrystalline silicon. Polishing slurry parameters correspond to the best world standards (for example, "Fudjimi" (Japan), Nalko (USA)).

Possibility of transfer abroad:
Licence's sale
Realization of finished commodity

Photo

Country Belarus

For additional information turn to:
E-mail: gal@uintei.kiev.ua